Two-part epoxy compound for structural bonding – GLT EB-6315
EB-6315 is two component epoxy for the application of electronic devices structural bonding. This product has low shrinkage and high thermal conductivity after cured, and it is suited for electronic devices and motors. This product exhibits high adhesion strength, greasy resistance, chemical and solvent resistance. The crack and fatigue resistance of this resin are outstanding in many vibrational applications. The durability of this product is very high levels and this resin can pass many environmental test experiments.
Features and benefits
- Two-component structural adhesive
- Excellent bonding strength on various surfaces
- Solvent-free, environmentally friendly
- Good heat tolerance, excellent thermal shock resistance
- Good thermal conductivity
- Good resistance to external conditions: moisture, water.
- Excellent dimensional stability over a wide temperature range
Specifications
Glass Transition Temp., (DSC), ℃
130
CTE (under Tg) µm/m/ ℃
38
CTE (above Tg) µm/m/ ℃
100
Durometer Hardness, Shore D
91
Specific Gravity
2.26
Bending Strength, MPa
120
Water Absorption Ratio (25℃/24hr), %
0.02
Degradation Temp. (TGA 10℃ /min),℃
342
Thermal Conductivity, W/mK
1.3
Temperature Range,℃
-40 ~ 200
Technical Documents
Technical Data Sheet
How can we support you?
If you need any assistance, do not hesitate to contact us
