Solve almost all of challenges raising during process of traditional potting, sealing and conformal coating for electronic protecting application
Electronic components need to be protected against moisture, dust dirt, vibration, and even temperature. Low Pressure Molding is an advanced method to take charge of this function with a gentle but reliable encapsulation around the electronic assemblies, especially the delicate ones.
- Sustainable and reworkable 1K Materials
- Excellence of moisture, chemical and high-temperature resistance; Watertight encapsulation; Good mechanical strength
- Simple process – fast cycle times