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Low Pressure Molding - GLUMO

Customizable LPM System meets your specific demand

1. What is Low Pressure Molding?

Electronic components need to be protected against moisture, dust dirt, vibration, and even temperature. Low Pressure Molding is an advanced method to take charge of this function with a gentle but reliable encapsulation around the electronic assemblies, especially the delicate ones.

2. Pros and Cons of Low Pressure Molding

Main Advantages:

  • Sustainable and reworkable 1K Materials
  • Excellence of moisture, chemical and high-temperature resistance; Watertight encapsulation; Good mechanical strength
  • Simple process – fast cycle times

GLUMO Low Pressure Molding Solution is able to solve almost all of challenges raising during process of traditional potting, sealing and conformal coating for electronic protecting application.

 
Traditional electronic protecting methodChallengesGLUMO Low Pressure Molding Solutions
Potting







Material mixing required – complicated 2K Mixing SystemOne-part material – No mixing require
Non – reworkable materialReworkable
Material range limitedTranslucent materials avalable for optical inspection
Large equipment investmetn and footprintLight-weight and simple system
8-step potting process3-step molding process
24-72 hours for curing schedule30 sec. – 2 min. cycle times
Rigid protectionStain-relief protection
5 – 7 BOM part numbers in inventoryOnly one materials – Green technology, no VOC
Sealing



Limited by housing dimentions; space constaintsNo-housing
48-72 hours for curing schedule30 sec. – 2 min. cycle times
Up to 6 process steps3-step molding process
5 – 7 BOM part numbers in inventoryOnly one materials – Green technology, no VOC
Conformal Coating



Very limited mechanical strengthTemperature, vibration, impact and chemical resistance; Watertight encapsulation; Good mechanical strength
4 – 12 hours cure schedule30 sec. – 2 min. cycle times
Up to 8 process steps3-step molding process
3 – 4 BOM part numbers in inventoryOnly one materials – Green technology, no VOC

Disadvantage of Low Pressure Molding and GLUMO Solutions

 
DisadvantageGLUMO Solutions
High initial investment in equipmentBuy Discount Equipment
Small-quantity productionLow Pressure Molding Service
Urgent ProblemLocal Service
Installation, Maintenance and Training

3. Applications

Industrial Sensors and Components

  • Door Sensor
  • Connectors
  • Security tokens
  • Microinverters
  • Monitoring systems
  • Switches
  • Optical encoders
  • Electronic controllers
  • Moisture sensors
  • Power regulators
  • Electric motors

Automotive

  • Automotive sensors
  • Temperature sensor
  • Medical sensor
  • Engine control units
  • Security sensor
  • Outdoor batteries

LED/ Lighting

  • LED nodes
  • Industrial sensor
  • Automotive lighting
  • Smart meter systems
  • Solar unit

Contact us for more details

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Low Pressure Molding Machine is one of two factors making significant effect on performance of thermoplastic molding process. GLUMO is specifically designed to be compatible with materials like copolyesters and polyamides. With very low injection pressure (20 ~ 500psi), our machine is confident to mold, seal, encapsulate to protect the most delicate electronic components against moisture, dust, high temperature, water and solvents, chemical, vibration and other agents in working environment.

In addition, GLUMO series can be customizable. Each application and manufacturing process will have different requirements about dimensions of working area, sharp design, configuration as well as performance index (cycle time, maximum pressure, temperature). After inspecting carefully customer demand, we could tailor-make their own unique version to provide the best performance of LPM process.

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Mold Set used for Low Pressure Molding differs from these other types of mold used in traditional high-pressure molding. In particular, we have to take some different aspects including materials, dimensions cavity design, etc. into consideration when designing. GLUMO is confident to work as a part of your engineer team, carefully inspect each element, then design the layout and finalize to provide the customer with the most appropriate mold set.

1. Material

Mold sets for low pressure molding are commonly manufactured from 7075 aluminum which is compatible with polyamide – LPM materials. Besides the negligibly wear-on feature, Aluminum is also a cost-effective material to be excellent at dissipating heat resulting in shorter cycle times. High wear-out areas where components are inserted should have steel inserts. Mold sets for very high production rates can be manufactured from P-20 material or any other conventional tool steel.

2. Dimensions

The mold set guides shall be approximately 35 mm long with 6 mm long tapered lead. Two different diameters shall be used such as 9 mm and 10 mm respectively.

3. Cavity Design

When designing a mold set, it is important to position the parting line so that the molded components stay in the lower mold half, when the mold set is opened. This may require a stepped parting line in some applications. It is often possible to avoid the use of locating pins as the low-pressure fill of the cavity is unlikely to dislocate components. When circuit boards are over-molded, these can be positioned by locating pins if necessary.

For some applications where holes from locating pins are unacceptable in the molded parts, a two-step over-mold should be considered. One side/portion of the component is over-molded first, then the other side/portion. These mold sets will have two different cavities and components are moved from the first to the second cavity for completion.

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