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What are components in GLUDITEC Inline Conformal Coating System?

The IGC-320 is GLUDITEC’s standard solution for efficient and high-precision conformal coating in electronic manufacturing. Each component of the system plays a crucial role in delivering reliable, moisture-resistant coatings to printed circuit boards (PCBs). Let’s...

Global Wearable Device Trends

The global wearable device market is rapidly evolving, driven by advancements in technology, changing consumer lifestyles, and growing demand for health monitoring and fitness tracking. From smartwatches and fitness bands to health-focused wearables, the industry...

How GLUDITEC AOI is Setting a New Benchmark in Conformal Coating Inspection

In the fast-changing world of electronics today, safeguarding printed circuit boards (PCBs) and ensuring their long-term reliability is essential. Environments that are harsh—marked by high humidity, extreme temperatures, corrosive gases, or salt spray—require a careful...

Solvent Base Conformal Coating Component Issues

At present, most of the solvent-coating adhesives in the market have 30-80% volatile components during the curing process. These components are organic volatiles that are harmful to the environment and the human body. Solvent type:...

Dual UV Conformal Coating Benefits over Traditional Solvent-base Coating

What is Dual UV Conformal Coating? Dual UV conformal coating is a type of protective coating applied to electronic circuits and components to provide insulation and protection from environmental factors such as moisture, dust, chemicals,...

Fiber optic connector bonding adhesive choosing guide

The majority of materials used for encapsulation in the optical fiber sector are primarily utilized in connectors, with a main emphasis on transparency, refractive index, and shrinkage properties. In the fiber optic connector assembly, multiple...

Enhancing Flip-Chip Technology: Addressing Thermal Expansion Challenges with Innovative Underfill Solutions

The introduction of novel substrate materials has presented flip-chip technology with fresh obstacles. Engineers are tasked with resolving issues stemming from the disparity in thermal expansion coefficients between the die and substrate to prevent the...

Underfill Rework Process Suggestion

Optimize your underfill rework process with these comprehensive steps Step 01: Component Stripping Begin by heating  he solder joint to a temperature higher than the reflow temperature to soften the adhesive, minimizing substrate damage. Once...

Conformal Coating System for Outside Operating PCBA

Conformal coating for Printed Circuit Board Assemblies (PCBAs) used in outdoor equipment such as lawnmowers and automotive applications offers several key benefits: Environmental Protection Conformal coatings provide a protective barrier against environmental elements such as...

UV Adhesive for Battery module harness reinforcement

Reinforcing battery module Flexible Printed Circuit Boards (FPCBs) poses several challenges, and addressing these challenges is crucial to ensuring the reliability and longevity of the battery module. Some common challenges associated with FPCB reinforcement in...

Soldering Flux Basic Information

What is Soldering Flux? IPC categorizes a flux as a chemical and physical agent that enhances the ability of molten solder to wet a metal surface by eliminating oxide or other surface films from the...

Battery Parylene Coating Cycle Process

Batteries play a crucial role as a widely used energy source for powering various electronic devices in different industries. With the increasing prevalence of electronics, there is a growing need for batteries to support their...