ES3403 Epoxy Adhesive for Underfilling, Dam & Filling

ES3403 is one component epoxy for electronic devices and it is also suited for the application of electronic devices dam, insulation, moisture resistance, encapsulation, and bonding. The resin offers good machinability and stability. This product exhibits high adhesion strength, greasy resistance, and chemical and solvent resistance. The durability of this product is high levels and this resin can pass many environmental test experiments. For its characteristic and reliability, this resin is used widely in various areas, as a high-performance adhesive.

Features and benefits

  • Medium viscosity and good leveling; providing matted surface
  • Highly vibrate-resist at ordinary temperature, good grinding properties
  • Excellent retained strength after environmental test
  • Excellent dimensional stability over a wide temperature range
  • Comply to the 2011/65/EU RoHS regulations
  • Comply to Chlorine < 900ppm, Bromine < 900ppm, Chlorine + Bromine < 1500 ppm



Properties ES3403
Appearance Liquid
Color Black
Viscosity *25°C, cps

S14 3rpm

Viscosity *25°C, cps

S14 0.3rpm

Thixotropic index 4.9


Properties ES3403
Pot Life, 25°C, days 2
Through Cured Time 120°C, min 60


Properties ES3403
Glass Transition Temp., (MDSC), °C 20
CTE (*2) (<Tg), μm/m/°C 48
CTE (*2) (>Tg), μm/m/°C 247
Durometer Hardness, Shore D 66
Specific Gravity (20/20°C) 1.25
Water Absorption Ratio (25°C/24hr), % 1.77
Water Absorption Ratio (80°C/24hr), % 3.23
Water Absorption Ratio (97°C/1.5hr), % 2.94
Young’s Modulus (DMA), MPa 60
Degradation Temp (TGA 100°C/min), °C 301
Weight Loss Ratio @100°C, % 0
Weight Loss Ratio @150°C, % 0.10
Weight Loss Ratio @200°C, % 0.45
Weight Loss Ratio @250°C, % 1.38
Weight Loss Ratio @300°C, % 4.91
Weight Loss Ratio @350°C, % 12.21
Volume Resistivity, Ohm-cm 5 x 10^15
Surface Resistivity, Ohm 5 x 10^14
Dielectric Constant 100Hz 4.1

Technical Documents

ES3403 Technical Data Sheet

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