ES3404 Single-part Epoxy for Chip Encapsulation

ES3404 is a one component epoxy adhesive for electronic devices with various applications such as casting and sealing. This resin can be fast cured at high temperature, which provides a tough, strong, structural bond to many substrates. When using for chip encapsulation, it can buffer the expansion and contraction stress of the bonding joint and can buffer the shear force conducted by the reaction force during the drop test.

Features and benefits

  • Low viscosity, excellent fluidity, solvent-free and non-volatile system, easy to operate.
  • The hardening surface will not exhibit a surface oiliness and poor gloss.
  • High rebound, fatigue and crack resistance.
  • The reactivity temperature is higher than 150oC.
  • Complying to the 2011/ 65/EU RoHS regulations.
  • Complying to chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm.



Properties ES3404
Appearance Liquid
Color Light yellow
Viscosity @ 25°C, cps

S21 20rpm

510 ~ 810
Specific Gravity 1.15


Properties ES3404
Pot Life, 25°C, days 5~7
Through Cured Time @ 80°C, min 30
Through Cured Time @ 100°C, min 15
Through Cured Time @ 120°C, min 10
Through Cured Time @ 150°C, min 5


Properties ES3404
Glass Transition Temp., (MDSC), °C 12
CTE (*2) (<Tg), μm/m/°C 80
CTE (*2) (>Tg), μm/m/°C 203
Durometer Hardness, Shore A 77
Specific Gravity 1.218
Degradation Temp

(TGA 10°C /min), °C

Water Absorption Ratio (25°C/24hrs), % 2.40
Water Absorption Ratio (80°C/24hrs), % 0.95
Water Absorption Ratio (97°C/1.5hrs), % 1.89
Weight Loss Ratio @ 100°C, % 0.03
Weight Loss Ratio @ 150°C, % 0.80
Weight Loss Ratio @ 200°C, % 1.69
Weight Loss Ratio @ 250°C, % 2.55
Weight Loss Ratio @ 300°C, % 4.18
Weight Loss Ratio @ 350°C, % 14.75
Volume Resistivity, ohm-cm 4/5 x 1015
Surface Resistivity, ohm 4.5 x 1014
Dielectric Constant 1KHz 3.2

Technical Documents

ES3404 Technical Data Sheet

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