Low Pressure Molding

GLUDITEC low pressure molding materials are specially designed for PCB protection while helping you cut cost and improve quality across different applications.

Our low pressure molding compounds include thermoplastic polyamides and polyolefin hot melt adhesives suitable for different low pressure molding systems. Low pressure molding is a faster and more efficient process than conventional potting. GLUDITEC is a one-part material that requires no mixing or curing and, therefore, reduces material consumption through streamlined, multi-level, and contour-exact encapsulation. This also constitutes a sustainable solution through its unique re-usable formulation and green chemistry. Integrating GLUDITEC low pressure molding compounds as an alternative to potting also reduces part numbers by eliminating the need for housing or additional parts to achieve strain relief.