HM3303 – Polyamide hotmelt for molding
HM3303 is hotmelt adhesive with 100% solid systems containing no solvent. This hotmelt has good adhesion strength to the substrate and provides good moisture protection, anti-corrosion, and anti-impact effects.
Package size: 25kg Bag
Shelf life: 2 years
#Low Pressure Molding Materials
#PCB Protection
Features and benefits
- High adhesion with many substrates.
- Good fluidity, excellent high and low-temperature resistance.
- Good insulation and flame retardant.
- Solvent-free, environmentally friendly, and safe to operate.
Specifications
TYPICAL PROPERTIES
| Properties | HM3303 |
| Base | Polyamide |
| Color | Natural/ Black |
| Softening Point, °C | 185-195 |
| Viscosity, 210°C, cps | 4000-7000 |
| Density, g/cm³ | 0.98 |
| Glass transition temperature, °C | ≤ -40 |
| Hardness, shore D | 35-45 |
| Elongation, % | ≥ 500 |
| Tensile strength, Mpa | ≥ 6.5 |
| Working temperature, °C | – 35- 150 |
Technical Documents
HM3303 - Technical Data Sheet
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