HM3306-B Hot melt adhesive for low pressure molding systems
HM3306-B hot melt adhesive, a black polymer thermoplastic polyamide resin, is suitable for low-pressure injection molding. It possesses non-corrosive properties, is odorless, and exhibits strong adhesion to various materials. Additionally, it has high-temperature resistance with low viscosity and excellent fluidity.
Direct Alternative for Technomelt PA6208 Black
Features and benefits
- Excellent bonding strength on plastic
- Wide range working temperature: -40 ~ 100°C
- Low viscosity and excellent fluidity
- Widely used for encapsulating of electronic components and the auto industry.
Specifications
| Properties | Typical Value | Range |
| Appearance | Black Solid | / |
| Chemical Type | Polyamide Resin | / |
| Hardness( Shore A) | 78 | 75~ 85 |
| Softening Point( Ball and ring method, ºC) | 143 | 140-150 |
| Mold Temperature (oC) | 190 | 180-200 |
| Viscosity (mPA.s) 200ºC | 2400 | 2000-4000 |
| Glass Transition Temperature (ºC) | -40 | / |
| Specific Gravity (g/cm3) | 0.98 | / |
| Elongation (%) | 700 | 600-800 |
| Tensile Strength (Mpa) | 3 | ³2 |
| Volume Resistivity (W.cm) | 1.5×10¹² | / |
| Working temperature (ºC) | -40 ~ 100 | |
| Dielectric Strength (KV/mm) | 19 | / |
Technical Documents
HM3306 - Technical Data Sheet
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