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UV536S Speaker Fixing UV Adhesive

UV536S is a high-performance UV adhesive specifically designed for SPK bonding applications in the earphone assembly process. With its high viscosity and exceptional thixotropy, this adhesive provides optimal control during application, ensuring precise bonding and minimizing the risk of overflow. It features a remarkable curing depth of up to 6mm, making it suitable for various assembly requirements.

UV536S is formulated to be environmentally friendly, free from organic tin and low in volatile organic compounds (VOCs), ensuring compliance with safety standards. Its dual cure mechanism—UV and moisture—allows for rapid curing under UV light while also enabling additional curing in challenging conditions, enhancing its versatility. This adhesive is the ideal choice for manufacturers seeking a reliable, high-strength bonding solution that meets the demands of modern earphone production while prioritizing environmental safety.

Features and benefits

  • Specialized UV adhesive for SPK bonding in earphone assembly
  • High viscosity and thixotropy for precise application
  • Curing depth up to 6mm
  • Free from organic tin and low VOC content
  • Environmentally friendly formulation
  • Dual cure mechanism (UV and moisture) for enhanced versatility

Specifications

UV536S Specifications
Product type UV Adhesive
Appearance Transparent
Curing Mechanism UV + Moisture Cure
Features High viscosity, high thixotropy, curing depth up to 6mm
Viscosity (25℃) 20,000 mPas
Thixotropic 5~7
Fluorescence Blue
Available Package Size 30/50ml
Typical Application SPK Fixing
Curing method Mercury lamp: 1000mJ/cm²
365nmLED: 5000mJ/cm²
Environmentally friendly and conformable Organic tin, VOC
Shelf life 6 months
Storage Temperature 2~8℃

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