PT-UV0041- Photo and moisture dual curing adhesive
FT-UV0041 is a UV curing adhesive with a shadow curing mechanism. It can be completely cured by the moisture reaction mechanism in the place where UV light can not be irradiated to avoid the uncovered monomer causing the electrical performance badly. It can be applied to bond the connector PVC/PET/PI withmetal connectors. Showing excellent surface drying, this resin will not bond hands or dust. This rapid-cured product is particularly suited for encapsulation application inelectronic field.
Features and benefits
1. This resin is suited for bonding of many plastics.
2. This product will not destroy by external force with high strength and fracture energy.
3. This product can use in the surface for cover to waterproof, dustproof, moisture-proof and other applications.
4. This product is suitable for spray coating, soaking, brushing, etc.
5. The hardness of this product will be more harder after two-stage moisture reaction.
6. This product complies to the 2011/65/EU RoHS regulations.
TYPICAL UNCURED PROPERTIES
|Viscosity 25°C, cps||130~300|
|Specific Gravity, 25°C||1.05|
|Solvent Content %||0|
TYPICAL CURING PROPERTIES
|Curing Equipment: Mercury-vapor lamp / Halogen lamp|
|Recommended Wavelength, nm||310 -420|
|Recommended main band, nm||365|
|Minimum Light Intensity, mW/cm^2||>50|
|Minimum Light Energy, mJ/cm^2||1500-2000|
TYPICAL CURED PROPERTIES
|CTE* (<Tg), μm/m/ºC||65|
|CTE* (>Tg), μm/m/ºC||205|
|Durometer Hardness ASTM D2240-03, Shore D||77|
|Linear shrinkage, %||3.41|
|Volume Shrinkage, %||11.63|
|Refractive Index nD @25.2ºC||1.5160|
|Water Absorption(25ºC / 24hr), %||0.2|
|Shear Strength, PMMA vs. PMMA, kg/cm^2||63|
|Shear Strength, FR4 vs. FR4, kg/cm^2||83|
|Shear Strength, PC vs. AL, kgf/cm2, 25ºC||73|
|Flexural modulus, Mpa, 25ºC||312|
|Degradation Temp., (TGA 10oC /min)ºC||318|
|Volume Resistivity, ohm-cm||1.6*1014|
|Surface Resistivity, ohm||1.4*1013|
|Dielectric Constant, 100HZ||3.2|
|Dielectric Strength, KV/mm||17|