ET5125 High-performance Structural Magnet Bonding
ET5125 is a top-tier structural adhesive that consists of epoxy resin, filler, curing agent, and various additives. It exhibits exceptional bonding properties with a wide range of materials such as metal, PVC, ABS, polycarbonate, wood, glass, ceramics, and more. For specific usage guidelines and recommendations, we recommend reaching out to our technical team for further assistance. Additionally, it boasts excellent ease of use during application and can be cured effectively at ambient temperature.
Features and benefits
- Strong adhesion to metal, PVC, ABS, polycarbonate, wood, glass, ceramics and other substrate
- Able to cure at room temperature
- Easy to handle
Specifications
Typical uncured properties
| Properties | ET5125A | ET5125B |
| Appearance | Viscous liquid | Viscous liquid |
| Color | Gray translucent | Yellowish-gray |
| Viscosity 25°C, ISO 3219, cps | 60,000±5000 | 7,000±1000 |
| Density, 250C, ISO 2811-1, g/cm³ | 1.22±0.05 | 1.05±0.05 |
Typical curing properties*
| Properties | Range |
| Mix ratio ( A:B) by weight | 100:43 |
| Mix ratio ( A:B) by volume | 100:50 |
| Density, 25ºC, ISO 2811-1, g/cm³ | 1.16±0.05 |
| Pot Life 25ºC, mins | 90 |
| Gel time, 25ºC, mins | 140 |
| Though cure time, 25ºC, hrs | 24 |
Typical cured properties*
| Properties | Range |
| Shore Hardness, 25°C (ISO 868), Shore D | 78±3 |
| Glass transition temp,(DSC) °C | 88±5 |
| Tensile strength, ISO 527, MPa | 38±5 |
| Dielectric Strength, 25°C (IEC 60243-1), MV/m | 25±2 |
| Elongation at break, ISO 527, % | 10±1 |
Technical Documents
ET5125 Magnet Bonding Epoxy Adhesive Technical Data Sheet
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