Tight tolerances and advances in chip design make image sensor applications very dynamic and complex. The applications generally fall into three categories: die attach, underfill, and IR filter bonding.
Die Attach
This process is just like any other die bonding process where a heat-cure adhesive is dispensed onto the substrate to accept the die. In this case, the image sensor die is bonded to the substrate.
Valves are generally not recommended due to the abrasive nature of the material, which would deteriorate the fluid-carrying parts of the valve.
Dispensing Controller as GC-824 provide the controlled dispensing required. Or in case requiring high accuracy, it typically requires non-contact dispensing with a jet valve such as GV-510 because of the speed and accuracy required.
Underfill
This process involves filling the voids under the sensor chip to improve cooling and temperature dissipation. It typically requires non-contact dispensing with a
jet valve such as GV-510 because of the speed and accuracy required.
IR filter bonding
A special IR filter is attached to the VCM module in auto-focus CCMs or to the lens holder in fixed-focus CCMs. This prevents unintentional light penetration from impairing sensor image quality. It can be done with a
needle valve or dispenser depending on production throughput and other requirements.
