UV5200 Photo-curing Adhesive for PCB Encapsulation
UV5200 is a photo-curing adhesive designed for PCB encapsulation. This product has a thick viscosity, and the resin is
transparent when applied. It can be cured quickly under ultraviolet or visible light and exhibits excellent adhesion
strength. The cured product offers insulation and moisture resistance to protect the circuit board
Features and benefits
1. High viscosity, toughness, and thermal shock resistance.
2. Offers insulation and moisture resistance to protect
PCB materials.
Specifications
| Properties | UV5200 |
| Appearance | Liquid |
| Color | Colorless |
| Viscosity 25°C, S14 100rpm, cps | 5,700 ~ 8,500 |
| Specific Gravity @25°C, RH 60% | 1.059 |
| Solvent Content, % | 0 |
| Heavy Metal Content, % | 0 |
Technical Documents
Technical Data Sheet
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