UV5129 Solder joint protection UV glue
UV5129 is a one-component, UV-curable, acrylic adhesive. This product is specially designed for bonding, fixing, and covering protection of electronic components; the product has the characteristics of low viscosity, fast curing speed, and good weather resistance.
TYPICAL APPLICATION
Electronic Component Solder joint protection UV glue
Specifications
UNCURED PROPERTIES
| Properties | Reference |
| Chemical composition | Polyurethane acrylic resin |
| Physical state | liquid |
| Exterior | Colorless transparent viscous liquid |
| Viscosity, mPa·s | 6500-9500 |
| Specific gravity Kg/L | 1.08 |
| Solvent content% | 0 |
| Heavy metal contentPPM | 0 |
CURING PROPERTIES
UV5129 will cure under sufficient ultraviolet irradiation conditions. The curing speed and depth depend on the light intensity, spectral distribution of the light source, irradiation time and the light transmittance of the adhered material. The following data are measured under the condition of ultraviolet radiation of 20mw/cm2 produced by a high-pressure mercury lamp:
| Properties | Reference |
| Fixed time (S) | 4 – 6s |
| Tack free time (1mm) | 10 – 15s |
| Deep curing time (1mm) | 25 – 30s |
| Full cure energy (1mm) | 800 mj/cm² |
CURED PROPERTIES
The following data are measured after curing with a high-pressure mercury lamp source with a cumulative energy of 800mj/cm²
| Properties | Test method | Reference |
| Hardness | Shore D | 73 – 78 |
| Operating temperature range | – 40～130℃ | Customer self-test |
| Shear strength | PC/ABS | ≥25N/cm² |
| Peel strength | PC/ABS | ≥15N/cm² |
Technical Documents
UV5129 Technical Data Sheet
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