UV5103H – Dual cure adhesive for Optical Component
UV5103H is a photo-curing cationic type and thermal curing adhesive for the optical component. This product can be pre-cured with UV light then thermal cured to develop outstanding adhesion properties, thermal-shock resistances and low shrinkage. For the special performance and reliability of this product, it is applied in various fields, such as C-MOS and it also provide low shrinkage and water absorption. With low viscosity and high thixotropic, this product is suited for dispensing equipment.
Features and benefits
• This product demonstrates outstanding adhesion properties on glass, metals and ITO. It is also suited for LCP525, PC (GF) and FR4 substrates bonding.
• This product exhibits lower water permeability which can effectively resist moisture.
• The retained strength of this product after environmental test experiments is still greatly high
• This product is solvent-free and low-pollution epoxy.
• This product complies to the 2011/65/EU RoHS regulations.
• This product complies to chlorine < 900ppm, bromine <900ppm, chlorine + bromine < 1500ppm.
Certifications
Specifications
TYPICAL UNCURED PROPERTIES
| Properties | UV5103H |
| Appearance | Liquid |
| Color | Milky |
| Viscosity *25°C, cps, S14, 50 rpm | 7,600 ~ 11,300 |
| Thixotropic Index | 5.2 |
| Specific Gravity | 1.53 |
TYPICAL CURING PROPERTIES
| Properties | UV5103H |
| Pot Life, 25°C, days | 3 |
| Curing condition 1, UV light | |
| Recommended Wavelength, nm | 310 – 365 |
| Recommended Light Intensity, mW/cm2 | > 50 |
| Recommended Light Energy, mJ/cm2 | 3,000 ~ 6,000 |
| Curing condition 2, Heat cure | |
| 80°C | 60 min |
TYPICAL CURED PROPERTIES
| Properties | UV5103H |
| Glass Transition Temp., (TMA), °C | 125 |
| CTE (*4) (<Tg), μm/m/°C | 51 |
| Durometer Hardness, Shore D | 88 |
| Specific Gravity | 1.67 |
| Volume Shrinkage, % | 1.02 |
| Water Absorption Ratio (25°C/24hr), % | 0.44 |
| Degradation Temp (TGA 100C / min), °C | 368 |
| Young’s modulus, GPa | 6.5 |
| Elongation, % | 2 |
| Shear Strength*1 Al vs Al, kgf/cm² | 98 |
| Shear Strength*1 Al vs LCP525, kgf/cm² | 58 |
| Shear Strength*1 Glass vs Glass, 0.3mm, kgf/cm² | 28 |
| Weight Loss Ratio @150°C, % | 0.06 |
| Thermal Conductivity, W/mK | 0.4 |
| Thermal Resistance, m²K/W | 0.003 |
| Diffusibility at 14 ~340C, 45 Degree Slope, 1g, mm | 0.1 |
| Surface Resistivity, ohm | 5 x 10^14 |
| Volume Resistivity, ohm-cm | 5 x 10^15 |
| Dielectric Strength, kV/mm | 18 |
| Recommended Temperature Range,°C | -40 ~ 150 |
Technical Documents
TDS_UV5103H
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