TIM4610K – One-part Thermal Conductive Putty
TIM4610K is one-part thermal conductive putty that is used to fill the gaps between the semiconductors and a cold surface such as a heatsink, to efficiently remove the heat generated by these heat sources to the ambient environment to maintain the junction temperature of the component within the safe operating limits.
TIM4610K material is a 10.0 W/m·K high-performance one-part thermal conductive gel material with excellent anti-segment and low volatility, the most valuable characteristics of this material are low oil bleeds and vertical reliability which is very important in application. Target applications for this material are Telecom, Consumer Electronics, and PC.
Features and benefits
- Thermal Conductivity 10.0W/m·K
- Low volatility
- Anti-sag
- Can be applied in different applications including Telecom, datacom, consumer electronics, optical module, automotive, etc
Specifications
| Properties | TIM4610K | Testing method |
| Appearance | Putty | Visual |
| Color | Pink | Visual |
| Thermal Conductivity | 10.0 W/m·K | ASTM D5470 |
| Density | 3.1 g/cm³ | 25°C |
| Flow Rate | 25g/min | 30cc syringe without tip, 90psi |
| Dielectric Strength | >5000V/mm | ASTM D149 |
| Operating Temperature | -50 ~ 160°C | — |
| Dielectric Constant | 7.6 | ASTM D150 |
| Volume Resistance | 10^13 Ohm.cm | ASTM D257 |
| UL | V-0 | UL94 Lab Test |
Technical Documents
TIM4610K - Technical Data Sheet
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