TIM4602 One-part Thermal Conductive Putty
TIM4602 is a unique thermal interface material crafted from silicone resin using a specialized formula and process. It boasts high thermal conductivity and can achieve low interface thermal resistance even under relatively low pressure. This material is ideal for placement between heat-generating power components and aluminum heat sinks or enclosures, where it effectively displaces air, minimizes thermal resistance due to air contact, and ensures an efficient filling effect.
APPLICATIONS
The product is widely used in mobile phone communication equipment, desktops, portable computers, and servers, LED lighting equipment, printed circuit board components, shell connection, optical fiber communication equipment, automotive electronics, military electronic equipment, and other electronic products between heating devices and heat dissipation aluminum sheets or casings filling and heat conduction, etc.
Features and benefits
- Good thermal conductivity, low thermal resistance;
- Very low deformation force, high compliance, good wettability;
- Strong plasticity, suitable for dispensing process;
- Good reliability.
Specifications
| Properties | TIM4602 | Testing method |
| Appearance | Putty | Visual |
| Color | Grey | Visual |
| Thermal Conductivity | 2.0±0.20 W/m·K | ISO 22007-2:2008, ASTM D5470 |
| Thermal Resistance (°C·in2/W) | 0.85 | @1mm, 40psi |
| Density | 2.70±0.27 g/cm³ | 25°C |
| Volume resistivity (Ω·cm) | ≥1.0×10^10 | ASTM D257 |
| Minimum bond thickness (mm) | 0.06 | Internal Test |
| Dielectric Strength | ≥6.0 kV/mm | ASTM D149 |
| Service Temperature | -40~125°C | Internal Test |
| UL | V-0 | UL94 Lab Test |
Technical Documents
TIM4602 Technical Data Sheet
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