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ST-3222-1 – Transparent 2K Silicone Potting Compound

ST3222-1 is a high-performance Transparent 2K Silicone Potting Compound designed for the professional encapsulation of sensitive electronic components. This two-part, addition-cure system features a convenient 1:1 mixing ratio by weight, curing into a durable, high-clarity elastomer that provides superior protection against environmental stressors.

Features and benefits

  • Zero Shrinkage & Non-Exothermic: Ensures internal components are not stressed during the curing phase.

  • Extreme Temperature Resistance: Operates reliably from  50~200

  • Superior Optical Clarity: Both Part A and Part B are clear, making it ideal for applications requiring visual inspection of components.

  • High Dielectric Strength: Provides robust insulation with a dielectric strength exceeding 18kV/mm.

  • Flexible Curing Options: Can be cured at room temperature or accelerated with heat ( 50~200) to match production speeds.

  • Environmentally Compliant: Fully complies with RoHS Directive requirements for global electronics manufacturing.

  • Excellent Adhesion: Features high shear strength, specifically 3.99MPa on PCB substrates.

Specifications

Mixing ratio (Part A: Part B)
1:1
Mixing viscosity
1000 - 3500 cps
Curing time @80°C
30 min
Curing time @100°C
20 min
Hardness
35 ± 5 Shore A
Dielectric strength
> 18kV/mm
Volume resistivity
> 1.0×1014Ω•cm
Dielectric constant
2.92 (100Hz)
Shear strength on Al
2.75 (MPa)
Shear strength on PCB
3.99 (MPa)

Primary Applications:

  • Automotive Electronics: Encapsulation of auto electric parts and sensors.

  • Power & Energy: Potting for solar panels and high-voltage power modules.

  • Circuit Protection: Waterproofing and moisture-proofing for Printed Circuit Boards (PCB)

Technical Documents

Technical Data Sheet

How can we support you?

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