SnSb12-1210 Lead-free High-temperature Solder Wire
The SnSb12-1210 Lead-free High-temperature solder wire is composed primarily of pure tin with added high-purity antimony, and it has been refined using advanced professional equipment for lead-free soldering. The product also features an optimized alloy ratio and a high-quality flux made from improved resin, organic activator, and various additives. Overall, this environmentally friendly lead-free solder wire delivers outstanding welding performance in high-temperature manufacturing thanks to its exceptional technology and special processing methods.
Features and benefits
- The packaged solder wire is flat, smooth, uniform.
- Distribution of flux is uniform and continues. No broken core.
- Excellent electric conductivity and thermal conductivity, fast speed of tin penetration,
- No pungent smell, less smoke and small splash when soldering.
- Low residue after soldering, uniform spreading, quick drying.
- High surface insulation resistance, stable and reliable electrical properties.
- Comply with RoHS requirement
Specifications
TYPICAL PROPERTIES
Items | Technical Parameters | Standards |
Part Number | SnSb12-1210 | / |
Metal Alloy | Sn88/Sb12 | / |
Appearance | Silvery white, smooth and clean surface, no crack. | Visual Inspection |
Diameter (mm) | 0.5; 0.6; 0.8; 1.0; 1.2; 1.5; 1.8; 2.0; | / |
Shelf Life | 2 years | From the date of production |
storage | Place at room temperature, dry and
non-corrosive environment |
From the date of production |
Packaging | 500g / Roll, 5kg/Box | / |
TYPICAL TECHNICAL PROPERTIES
Items | Technical
Parameters |
Standards |
Content of Flux
(wt %) |
0.0±0.0/2.0±0.5
2.5 ±0.5/3.0±0.5 3.5±0.5 |
IPC-TM-650
2.3.34.1 |
Melting Point
(°C) |
260 | / |
Copper Mirror Test | Non-penetrating corrosion | IPC-TM-650 2.3.32 |
RoHS | Pass | RoHS Directive |
Continuity of Flux Distribution, Broken Hole | Continuity, No Broken Hole | / |
Copper Corrosion Test | No significant Corrosion | IPC-TM-650 2.6.15 |
Content of Halogen | L1 | IPC-TM-650 2.3.33 |
Expansion Rate (%) | ≥70 | JIS-Z-3197 8.3.1.1 |
Residue Dryness | PASS | IPC-TM-650 2.4.47 |
Technical Documents
SnSb12-1210 - Technical Data SheetHow can we support you?
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