SN4701-8.5 – Silicone-free Phase Change Material
SN4701-8.5 series, phase change thermal conductive material is a new type of thermal interface material composed of silicon-free substrate. When in use, when the temperature reaches the phase transition point, the state of the material changes, from solid state to flow dynamics, filling the interface gap, with extremely low thermal resistance and excellent thermal conduction effects.
Features and benefits
- Extremely low thermal resistance, efficient heat dissipation.
- Excellent heat transfer properties, and easy to use.
- Heat and pressure, the material will be further thinned, thermal resistance will be lower.
- Excellent thermal stability, long-term use
Specifications
PROPERTIES
| Item | Parameter | Unit | Test Method |
| Color | Dark Grey | – | Visual |
| Thickness Range | 0.3 ~ 0.5 | mm | ASTM D374 |
| Density | 2.8 | g/cc | ASTM D792 |
| Phase Change Temerature |
50 | °C | DSC |
| Operating Temperature |
-40 ~ 125 | °C | IEC 60068 -2-14 |
THERMAL CHARACTERISTIC
| Thermal Conductivity |
8.5 | W/m-K | ASTM D 5470 |
| Thermal Resistance |
≤0.045(@40psi/80°C) | °C.cm2/W | ASTM D 5470 |
Technical Documents
TDS - SN4701-8.5
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