PTV-600 Small Size Vacuum Plasma System

The PTV-600 is a compact vacuum plasma system engineered to deliver high precision surface treatment with lightning-fast response times. Boasting exceptional handling and compatibility, this system offers perfect functionality coupled with professional technical support. It finds wide-ranging applications in industries spanning from camera and mobile phone manufacturing to semiconductor IC fields and beyond.


Camera & Mobile Phone Manufacturing

Essential for the deoxidation of the gold PAD surface on rigid-flex boards, and infrared (IR) surface cleaning, ensuring high-quality camera and fingerprint recognition components.

Semiconductor IC Field

Crucial for processes such as COB, COG, COF, and ACF, the PTV-100 is used for wire bonding and pre-soldering cleaning, ensuring reliable and precise semiconductor manufacturing.

Silicone, Plastic, and Polymer Fields

Enhances surface roughening, etching, and activation of silica gel, plastics, and polymers, vital for applications in automotive electronics, aviation, and other polymer-related industries.

Features and benefits

  • High Precision & Fast Response
  • Versatile Handling & Compatibility
  • Comprehensive Functionality


Properties PTV-100
External dimensions W920 x D960 x H1720 mm
Vacuum chamber W400 x D400 x H400 mm, 64L
Electrode plate specifications 6-layer flat plate electrode plate 380(W)×310(D) mm
Control system Touch screen + PLC control
Vacuum measurement system Pirani resistance gauge
Gas metering system Accurate Mass Flow Control Meter MFC
Number of gas paths 2 channels intake, 1 way venting
Plasma generator 500W&1KW plasma generator, 40KHz (optional 13.56MHz)
Working gases 2 working gases are optional: Ar2, N2, H2, O2

Plasma can be easily generated in a vacuum environment with lower energy requirements compared to normal atmospheric conditions. This is why equipment utilizing vacuum chambers is commonly used for creating plasma. The process begins by using a pump to remove air from the chamber, followed by introducing the desired gas once the target vacuum level is achieved. By maintaining a stable pressure through continuous pumping and gas injection, known as process pressure, the chamber is prepared for plasma formation. Applying either a radio frequency (RF) of 13.56Mhz or a microwave frequency of 2.45Ghz triggers the gas to transform into plasma within the chamber. The movement of plasma electrons and ions sustains the plasma state throughout the chamber via diffusion. The outcome of plasma treatment depends on factors such as gas quantity, wavelength intensity, and duration of operation. Microwave frequencies produce denser plasmas compared to RF due to their shorter wavelengths, making them ideal for high-level applications with uniformity at lower temperatures.


Technical Documents

PTV-600 Technical Data Sheet

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