PbAg25-1211 – High temperature Resistant Leaded Solder Wire

This leaded solder wire, known as PbAg25-1211, is designed to withstand high temperatures and is made from top-quality lead ingots with added high-purity tin and silver. Utilizing advanced soldering equipment and superior technology, this product undergoes special processes to refine its composition. The alloy ratio is carefully balanced, while the flux is crafted from premium modified resin along with organic activators and additives. Overall, it offers outstanding welding performance and environmental friendliness for high-temperature applications.

Features and benefits

  • The coiled wire is neat, smooth, smooth, evenly wound, and will not get tangled during routing.
  • The flux in the wire is evenly distributed, with good continuity and no core breakage.
  • Excellent electrical conductivity and thermal conductivity, fast tin application and strong wetting power.
  • No irritating smell, less smoke and less spatter during welding.
  • Less residue after welding, even spreading and quick drying.
  • After welding, the surface insulation resistance is high and the electrical performance is stable and reliable.
  • It is a green and environmentally friendly product that complies with RoHS and other environmental protection requirements.



Items Technical Parameters Standards
Part Number PbAg25-1211 /
Metal Alloy Pb92.5/Sn5/Ag2.5 /
Exterior Silvery white, smooth and clean surface, no crack. Visual Inspection
Diameter (mm) 0.5; 0.76 etc. /
Shelf Life 2 years From the date of production
Storage Store at room temperature, in a dry and non-corrosive environment /
Packaging 500g / Roll, 5kg/Box /


Items Technical


Content of Flux

(wt %)





Melting Point


288 – 298 /
Copper Mirror Test Non-penetrating corrosion IPC-TM-650 2.3.32
RoHS Qualified RoHS Directive
Continuity of Flux Distribution, Broken Hole Uniform and continuous, no gaps GB/T 20422-2006


Copper Corrosion Test No significant Corrosion IPC-TM-650 2.6.15
Content of Halogen L1 IPC-TM-650 2.3.33
Expansion Rate (%) ≥70 JIS-Z-3197
Residue Dryness The surface of the flux residue should be free of stickiness sex, chalky on the surface should be easily removed IPC-TM-650 2.4.47

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