MSC-0114M – Automatic multi-site cleaning system

MSC system adopts the closed mode, using fully automatic moving arm structure, consists of series modular unit tanks to utilize all kinds of cleaning technology. It is designed for cleaning flux residue, solder paste and SMT glue that is adhered in IC, semiconductor, PCBAs and electronic part.

The machine system can also meet a high degree of automation, mass cleaning capacity and high surface cleanliness.

Features and benefits

  • Having high loading capacity to meet mass cleaning capacity
  • Microcomputer control, automatic mobile arm, save manpower, and a high degree of automation
  • The integrated use of various types of cleaning technology, adapt to the high precision cleaning requirements (ultrasonic & spraying modular, air bubble & spraying agitation modular, dynamic spraying modular, dryer modular)
  • High-performance liquid circulating filtration system ensures waste filter more efficiently, and keeps the cleaning agent bath life longer
  • Special aluminum frame, acid and alkali resistant stainless-steel plate, fully closed structure.



Function of each station
Ultrasonic/ immersion spraying/ spraying/ air bubbling/ hot air drying
Tank amount
Single tank volume
Outline size (mm)
L5000 x W1800 x H2200
Single tank inside size (mm)
L620 x W400 x H400
Voltage/ Frequency (V/Hz)
380/ 50
Total power (kW)

How can we support you?

If you need any assistance, do not hesitate to contact us