MS564S FPC reinforcement, wiring harness, device fixation
MS564S is a versatile modified silicone adhesive designed for superior sealing and bonding in both heat-resistant and cold-resistant environments. Free from organic tin, this adhesive ensures safety and environmental compliance without compromising performance. Its quick-drying formulation allows for efficient application, making it ideal for time-sensitive projects.
This adhesive is particularly well-suited for FPC reinforcement, providing reliable support for flexible printed circuits, ensuring durability in electronic devices. Additionally, MS564S excels in wiring harness applications and device fixation, offering strong adhesion and flexibility that withstands temperature fluctuations. Its ability to maintain performance across a wide temperature range makes it an essential choice for manufacturers in the electronics and automotive industries. Whether you’re looking for a safe, effective solution for bonding or sealing, MS564S delivers the reliability and performance required for modern technological applications.
Features and benefits
- Modified silicone adhesive with no organic tin
- Quick-drying formulation for efficient application
- Effective in heat-resistant and cold-resistant environments
- Ideal for FPC reinforcement and wiring harness applications
- Strong device fixation capabilities
- Safe and environmentally compliant solution
Specifications
| MS564S | Specifications |
| Product type | Modified Silicone Adhesive |
| Features | Contains no organic tin, dries quickly, and is used for sealing and bonding in heat-resistant and cold-resistant environments |
| Viscosity (25℃) | 20,000 mPas |
| Full Cure Time, 25℃/50RH%: | 24h |
| Surface Drying Time | 7 mins |
| Available Package Size | 15ml/ 300ml |
| Appearance | Black Paste |
| Typical Application | FPC reinforcement, wiring harness, device fixation |
| Curing method | Moisture curing |
| Shelf life | 6 months |
| Storage Temperature | 8-28℃ |
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