MS558S FPC reinforcement, wiring harness, device fixation
MS558S is a high-performance modified silicone adhesive designed for diverse applications, particularly in the electronics and automotive industries. Formulated without organic tin, this adhesive ensures safety and environmental compliance while delivering reliable performance. It features a moisture-curing mechanism that promotes fast surface drying, making it ideal for various applications where quick handling is essential.
MS558S excels in FPC reinforcement, providing robust bonding for flexible printed circuits, ensuring durability and reliability in electronic devices. Its versatility also extends to wiring harness applications and device fixation, where it offers excellent adhesion and flexibility. This adhesive maintains its performance across a wide temperature range, making it suitable for challenging environments. MS564S is the perfect choice for manufacturers seeking a safe, efficient, and effective adhesive solution that meets the demands of modern technology.
Features and benefits
- Modified silicone adhesive without organic tin
- Moisture curing for fast surface drying
- Ideal for FPC reinforcement and wiring harness applications
- Excellent device fixation capabilities
- Safe and environmentally compliant formulation
- Versatile and suitable for various challenging environments
Specifications
| MS558S | Specifications |
| Product type | Modified Silicone Adhesive |
| Features | No organic tin, moisture curing, fast surface drying, suitable for spraying |
| Viscosity (25℃) | 30,000 mPas |
| Full Cure Time, 25℃/50RH%: | 24h |
| Surface Drying Time | 7 mins |
| Available Package Size | 15ml/ 300ml |
| Appearance | Black Paste |
| Typical Application | FPC reinforcement, wiring harness, device fixation |
| Curing method | Moisture curing |
| Shelf life | 6 months |
| Storage Temperature | 8-28℃ |
How can we support you?
If you need any assistance, do not hesitate to contact us
