MMC-011 – Multi-modular cleaning machine
MMC machine consists of series modular unit tanks for different functions, utilize all kinds of cleaning technology. It is designed for cleaning flux residue, solder paste and SMT glue that is adhered in IC, semiconductor, PCBAs and electronic part.
The machine system can meet mass cleaning capacity and high surface cleanliness after cleaning at the same time. Using multi-station continuous operation, it can also ensure the perfect of cleaning and rinsing by the immersion cleaning method.
Features and benefits
- Having high loading capacity to meet mass cleaning capacity
- The machine system including ultrasonic & spraying modular, air bubble & spraying agitation modular, dynamic spraying modular, dryer modular
- The multi-function designed in single modular meets different process requirements. It is also feasible to shift to different modular while keeps the machine system unaltered
- High-performance liquid circulating filtration system ensures waste filter more efficiently, and keeps the cleaning agent bath life longer
Specifications
4 modules for 4 main functions:
Ultrasonic & Spraying Modules
- Deep Cleaning: Ultrasonic technology generates high-frequency sound waves, creating cavitation bubbles that implode on surfaces, dislodging contaminants from intricate parts and hard-to-reach areas.
- Versatility: Combined with spraying functionality, this module offers versatility in cleaning various types of contaminants, including flux residue, solder paste, and adhesives.
- Gentle Cleaning: While ultrasonic action is powerful, it’s also gentle on delicate components, ensuring thorough cleaning without causing damage.
- Uniform Coverage: Spraying ensures uniform coverage of cleaning agents across the surface of components, maximizing cleaning efficiency.
Air Bubble & Spraying Agitation Modules
- Enhanced Agitation: Air bubble agitation creates turbulence in the cleaning solution, enhancing the removal of contaminants from complex geometries and blind holes.
- Efficient Mixing: Combined with spraying agitation, this module facilitates efficient mixing of cleaning agents with the cleaning solution, ensuring consistent and effective cleaning performance.
- Particle Suspension: Air bubble agitation helps suspend particles and debris in the solution, preventing recontamination of cleaned surfaces.
- Improved Rinse: The agitation action ensures thorough rinsing, removing residual cleaning agents and leaving surfaces clean and residue-free.
Dynamic Spraying Modules
- High-Pressure Cleaning: Dynamic spraying utilizes high-pressure jets to dislodge stubborn contaminants and ensure thorough cleaning of surfaces.
- Precision Targeting: The ability to direct spraying precisely at specific areas allows for targeted cleaning, reducing waste and optimizing cleaning efficiency.
- Quick Cleaning Cycles: Dynamic spraying can expedite the cleaning process, reducing cycle times and improving overall throughput.
- Adaptability: This module is effective for cleaning various components with different shapes, sizes, and surface characteristics, making it highly adaptable to diverse cleaning requirements.
Dryer Modules
- Moisture Removal: Dryer modules efficiently remove moisture from cleaned components, preventing water spots and ensuring rapid drying for subsequent processing or assembly.
- Prevention of Corrosion: Complete drying helps prevent corrosion of sensitive electronic components, ensuring long-term reliability.
- Energy Efficiency: Advanced drying technology maximizes energy efficiency, reducing operating costs and environmental impact.
- Consistent Results: Uniform drying across all components ensures consistent cleanliness levels, maintaining quality standards throughout the production process.
These detailed benefits showcase how each module within the MMC Series contributes to the overall effectiveness, efficiency, and versatility of the cleaning system, meeting the diverse needs of electronic component cleaning in various industries.
| Model | Function | Volume (L) | Outline size (mm) | Tank size (mm) | Volt/ Freq (V/Hz) | Total power (kW) |
| MMS-010U | Ultrasonic/ Immersion spraying | 100 | 850x900x850 | 710x350x405 | 220/50 | 6 |
| MMS-010S | Dynamic spraying | 100 | 850x900x850 | 710x350x405 | 220/50 | 3 |
| MMS-010B | Immersion spraying/ Air bubbling | 100 | 850x900x850 | 710x350x405 | 220/50 | 5 |
| MMS-010D | Hot air drying | 100 | 850x900x850 | 710x350x405 | 220/50 | 5 |
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