LPM-8000S, Advanced Melt-on-demand Low pressure molding machine
The LPM-8000S is an advanced low pressure molding machine specifically engineered for encapsulating and protecting sensitive electronics
This system ensures delicate components like PCB assemblies, sensors, and connectors are fully sealed without damage by injecting hotmelt material at low temperatures (180-240C and low pressures (1.5-40 bar).
Featuring a state-of-the-art melt-on-demand design, the LPM-8000S eliminates material cracking and carbonization, making it the perfect choice for color-critical and high-precision applications
Features and benefits
- Melt-on-Demand Technology: Hotmelt is melted only when needed to prevent material degradation.
- 7″ HMI Touch Screen: Intuitive interface for real-time process monitoring and recipe management.
- 6-Zone Thermal Control: Independent zones ensure precise and stable melting temperatures.
- Small footprint
- Automation ready
Specifications
HMI Screen
7-inch color touch screen
Heating Zones
6 independent zones
Heating capabilities
Up to 280C
Injection Pressure
1.5 - 40 bar
Clamping Force
up to 1800kg
Machine Dimensions
1,660 x 740 x 1,756 mm
Gross weight
400 Kg
Technical Documents
Technical Data Sheet
How can we support you?
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