HM3310 Hot Melt Adhesive
GLUDITEC HM3310 is a high-molecular-weight polyamide hot melt adhesive resin supplied as amber brown pellets. Engineered for strong and durable bonding performance, GLUDITEC HM3310 offers high mechanical strength, excellent flexibility, and stable electrical insulation performance across a wide service temperature range of -30°C to 125°C. It is soluble in organic solvents such as benzene and alcohols, making it an optimal choice for low-pressure molding (LPM) encapsulation, PVC lamination, automotive interior accessory packaging, and specialized ink formulations.
Features and benefits
- High Mechanical Strength: High tensile strength (> 4 MPa) and elongation at break (> 190%) tested per ASTM D638-00.
- Wide Service Window: Operates across -30°C to 125°C, remaining flexible in cold conditions while resisting softening under heat.
- Excellent Adhesion: Delivers high bond strength across composite inks, PVC sheets, hot-melt films, and automotive components.
- Balanced Hardness & Flexibility: Shore A/D hardness of 90/42 with retained flexibility for demanding bonding geometries.
- Low Water Absorption: Low moisture absorption rate of 2.0% (ISO 62) supports dimensional and adhesive stability in humid environments.
- Electrical Insulation: Good dielectric performance suitable for protecting electrical and electronic components.
- Solvent Solubility: Soluble in common organic solvents (benzene, alcohols) for coating and ink formulation compatibility.
Specifications
| Property / Parameter | Value | Test Method |
|---|---|---|
| Appearance | Brown-pellet, amber color | — |
| Viscosity @ 220°C | 3,500 ~ 5,000 mPa·s | — |
| Softening Point | 155 ± 5 °C | — |
| Specific Gravity @ 23°C | 1.07 g/cm³ | — |
| Hardness (Shore A/D) | 90 / 42 | ISO 868 |
| Water Absorption | 2.0% | ISO 62 |
| Max Tensile Strength | > 4 MPa | ASTM D638-00 |
| Elongation at Break | > 190% | ASTM D638-00 |
| Low Temperature Test | -30 / -35 °C | ASTM D3111 |
| Applicable Ambient Temperature | -30 ~ 125 °C | — |
| Melt Temperature Range | 200 ~ 210 °C | — |
| Mold Temperature Range | 30 ~ 40 °C | — |
| Drying Time | 6 ~ 8 hr | — |
| Drying Temperature | 70 °C | — |
| Processing Moisture Content | < 0.6% | — |
| Transversal Resistivity (500V) | 2.9×10¹² Ω·cm | IEC 60093 |
| Dielectric Rigidity | 20 kV/mm | IEC 60243-1 |
| Relative Permittivity | 5.6 | IEC 60250 |
| Vicat Temperature | 63 °C | ISO 306 |
| Glass Transition (DSC) | -30 °C | — |
| Packaging | 20 kg net, paper bag | — |
| Shelf Life | 12 months in closed original packing (cool & dry location) | — |
Technical Documents
Technical Data Sheet
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