HM3309 – Polyamide for low pressure molding
HM3309 is a premium, high-temperature polyamide hot melt adhesive designed for low-pressure molding, electronics encapsulation, and cable potting. It features excellent thermal resistance, quick setting times, and stable weatherproofing for demandingindustrial and automotive wiring harness applications.
Features and benefits
• Versatile Softening Point: Tailored to meet the strict performance needs of diverse high-temperature applications.
• Excellent Processing Fluidity: Outstanding melt fluidity ensures easy molding, precise shaping, and seamless encapsulation.
• Superior Thermal Resistance: Exceptional high and low-temperature resistance coupled with robust toughness under normal room temperatures.
• High Initial Tack: Strong instant bonding and stable weather resistance for long-term reliability.
Specifications
| Properties | Specifications | Test Methods |
| Component | Polyamide | — |
| Appearance | Black, white and natural granules | — |
| Softening Point | (180 ±10∘????) | ASTM E28 |
| Viscosity | 3500±1000 | ASTM D3236 |
| Open Time | ≤15s | (230°C) |
| Service Temperature | 210 ∼ 230∘C | — |
Technical Documents
Technical Data Sheet
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