HM3308 – Polyamide for low pressure molding
HM3308 is apremium polyamide (nylon) thermoplastic hot melt adhesive engineered with exceptional weather resistance and highly stable performance. Designed with superior fluidity, high toughness, and excellent thermal resistance , HM3308 serves as the ideal solution for low-pressure molding (LPM), component encapsulation, and heavy-duty cable/connector sealing.
Features and benefits
• Excellent Temperature Resistance: Demonstrates outstanding high and low temperature stability to endure harsh environments.
• Superior Fluidity & Easy Shaping: Flows smoothly into intricate molds, ensuring perfect encapsulation without damaging sensitive components.
• High Toughness: Delivers robust impact resistance and structural integrity under normal room
temperatures.
• Strong Initial Tack: Provides rapid bonding and high initial green strength to optimize assembly line cycle times.
Specifications
| Properties | Specifications | Test Methods |
| Component | Polyamide | |
| Appearance | Black granules | |
| Softening point | 160 ±10°C | ASTM E28 |
| Viscosity (200°C) | 3500±1000 | ASTM D3236 |
| Open time | ≤15S | （230℃） |
| Service temperature | 180~230℃ |
Technical Documents
Technical Data Sheet
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