ES5101 Electrically Conductive Adhesive
Product Introduction
ES5101 is a high-performance, silver-filled electrically conductive adhesive engineered by Gluditec for precision microelectronics assembly. Designed specifically for die attach applications, this adhesive facilitates the secure mounting of small to medium-sized dies onto silver-plated, gold-plated, and copper leadframes. The material is optimized for high-volume manufacturing environments, offering a versatile range of curing profiles including snap cure on hot plates and standard oven curing.
Features and benefits
General Features
The adhesive is characterized by its versatile curing options and high reliability:
- Flexible Curing: It supports snap cure (on a hot plate), oven cure, and hot plate cure.
- High Performance: Offers minimal bleeding and minimal volatiles during processing.
- Strong Adhesion: Provides good bonding, particularly on silver-plated leadframes, with a die shear strength of $>2.5$ Kg/die (for 45mil x 45mil Si die on Ag LF)
- Conductivity: Features high electrical conductivity with a volume resistivity of $<0.0005$ Ohm.cm.
- Thermal Management: Maintains a thermal conductivity of 1.8 W/mk.
- Storage Requirements: Must be stored at -40°C to maintain a 6-month shelf life.
General Applications
ES5101 is primarily used for die attach processes in semiconductor packaging. Its specific applications include:
- Small to Medium Die Attachment: Specifically formulated for attaching small to medium-sized dies.
- Leadframe Bonding: Designed for use with silver and gold-plated lead frames, as well as copper lead frames.
Specifications
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