GLT 531-5 – Epoxy for BGA CSP Underfill
GLT 531 – 5 is one component epoxy adhesive for electronic devices bonding. This product is easy to operate and suited for various applications of electronic components, such as casting and sealing. This resin can be fast cured at high temperature, is able to reduce the working time and increase the efficiency at the same time. This product develops tough, strong, structural bonds which providing excellent shear, peel and impact strength The durability of this resin is very high levels and this resin can pass many environmental test experiments.
Features and benefits
- This product is solvent free, non volatile, system and has no volative materials and will not release any toxic volatilizations
- This resin is low viscosity, excellent fluidity and easy to operate It is suited for casting
- The hardening surface will not exhibit a surface oiliness and poor gloss
- This product complies to the 2011 65 /EU RoHS regulations
- This product complies to chlorine 900 ppm, bromine 900 ppm, chlorine bromine 1500 ppm
Certifications
Specifications
TYPICAL UNCURED PROPERTIES
| PROPERTIES | GLT 531-5 |
| Appearance | Black, liquid |
| Viscosity 2 55°C S21 20rpm, cps | 240~250 |
| Specific Gravity | 1.19 |
| Pot life (2525°C ), days | 2 |
| Through Cure Time (130130°C), min | 10 |
| Through Cure Time (150150°C), min | 5 ~ 8 |
TYPICAL CURED PROPERTIES
| PROPERTIES | GLT 531-5 |
| Glass Transition Temp ºC | 103 |
| CTE*2 (<Tg), μ m/m/ ºC | 64 |
| Specific Heat 0ºC, J/gºC | 1.11 |
| Durometer Hardness, (Shore D) | 80 |
| Water Absorption Ratio (25ºC/24hr), % | 0.21 |
| Volume Shrinkage, % | 2.0 |
| Flexural Modulus, GPa | 2.7 |
| Degradation Temp, (TGA 10 ºC/min),ºC | 264 |
| Weight Loss Ratio@100 ºC (%) | 0.14 |
Technical Documents
TDS - GLT 531-5
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