FL1601 – Water–base No–clean Lead–free Soldering Flux
Currently, the majority of fluxes rely on volatile organic compounds (VOCs) as solvents, which pose environmental and health risks due to their flammability and harmful effects. As a response to these issues, FL-1601 utilizes deionized water as a solvent instead of VOCs, offering a solution to the drawbacks associated with traditional solvents. This innovative approach allows for the use of various lead-free solders and delivers outstanding application results. FL-1601 represents a novel environmentally friendly lead-free solder and an optimal water-based flux that requires no cleaning.
Features and benefits
- Low surface tension and high solderability and flowability, patented product.
- Strong wettability and excellent ability of tin-penetration.
- The residues after welding are spread evenly, high reliability.
- Contains no VOC substances, no RoHS and other environmentally banned substances; non-flammable, safe to use, environmentally friendly flux.
Certifications
APPLICATIONS
It is applied to various lead-free solders and widely used in power source, communication devices, audio devices, refrigeration devices, medical appliances etc. It can be used with techniques of spraying, dipping and expanding foam.
Specifications
| Items | Technical Parameters | Standards |
| Part Number | FL-1601 | / |
| Flux Classification | ORLO | J-STD-004A |
| Appearance | Colorless transparent liquid | / |
| Solid content ( wt %) | 3.00 ± 0.80 | GB/T 9491-2002 5.4 |
| Specific Gravity (20°C) | 0.979 ± 0.010 | / |
| Acid Valve ( mg KOH/g) | 22.00 ± 5.00 | JPC-TM-650 2.3.13 |
| Expansion Rate (%) | ³75 | JIS-Z-3197 8.3.1.1 |
| Chromate Paper Test | PASS | JPC-TM-650 2.3.33 |
| Copper Mirror Corrosion | PASS | JPC-TM-650 2.3.32 |
| Corrosion Test | PASS | JPC-TM-650 2.6.15 |
| SIR (W) | ³1.0×10⁸ | JPC-TM-650 2.6.3.3 |
| ECM | PASS | JPC-TM-650 2.6.14.1 |
| RoHS | PASS | RoHS Directive |
Technical Documents
Technical Data Sheet
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