ET5101 – Two-part Epoxy for Electronic Devices
ET5101 is two-component epoxy specially designed for electronic devices. This resin has low viscosity, good transparent, perfect surface gloss and high bonding strength. ET5101 can cure rapidly at low temperature and is suitable for wide range of materials: metal, glass, ceramic and plastic as well.
Features and benefits
- Two-component Epoxy Base
- Non-moisture-sensitive hardener
- Excellent insulation properties
- High bonding strength
- Excellent chemical & solvent resistance
- Dimensional stability over a wide temperature range
- Comply to 2011/65/EU RoHS RegulationsComply to chlorine < 900ppm, bromine < 900 ppm, chlorine + bromine < 1500 ppm
Certifications
Specifications
TYPICAL UNCURED PROPERTIES
| Properties | ET5101 – A | ET5101-B |
| Appearance | Liquid | Liquid |
| Color | Colorless | Light yellow |
| Viscosity *25 C, cps |
4,000~6,000 S14, 100rpm |
1,000~2,000 S14, 100rpm |
TYPICAL CURING PROPERTIES
| Properties | |
| Mix Ratio (A:B) by Weight | 2:1 |
| Pot Life, 25 C, min | 30 |
| Tack Free Time, 25 C, min | 160 |
| Through Cured Time, 25 C, hr | 5 |
| Through Cured Time, 80 C, hr | 1 |
* A:B= 2g:1g
TYPICAL CURED PROPERTIES
| Glass Transition Temp., (DSC), C | 64 |
| Durometer Hardness, Shore D | 82 |
| Specific Gravity | 1.07 |
| Water Absorption Ratio (25 C/24hr), % | 0.50 |
| Shear Strength Al vs Al, kg/cm2 | 264 |
| Shear Strength PC vs PC, kg/cm2 | 65 |
| Shear Strength ABS vs ABS, kg/cm2 | 72 |
| Shear Strength PVC vs PVC, kg/cm2 | 42 |
| Degradation Temp (TGA 10 C/min), C | 357 |
| Weight Loss Ratio @100 C, % | 0 |
| Weight Loss Ratio @150 C, % | 0.04 |
| Weight Loss Ratio @200 C, % | 0.24 |
| Weight Loss Ratio @250 C, % | 0.56 |
| Weight Loss Ratio @300 C, % | 1.40 |
| Weight Loss Ratio @350 C, % | 3.92 |
| Volume Resistivity | 5*10 ohm-cm |
| Surface Resistivity | 5*10 ohm |
| Dielectric Constant, 100Hz | 4.0 |
| Coefficient of thermal expansion (CTE) | 68 µm/m/K |
* Specimen Cure Condition：80oC / 1hr
Technical Documents
TDS - ET5101
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