ET3400 Re-enterable Encapsulant High Gel
ET3400 Re-enterable Encapsulant High Gel is a two-part epoxy developed for electronic device encapsulation. This product can firmly stick to the PCB. It offers adhesion strength for general plastics used in the electronic connector. The cured product offers excellent flexibility that can easily re-enter the wire joint and is convenient for modification and maintenance.
Features and benefits
- Repairable potting & encapsulating resin
- Good flexibility.
- Excellent operability.
- Gloss hardening surface.
- Complies to the 2011/65/EU RoHS regulations.
Specifications
TYPICAL UNCURED PROPERTIES
| Properties | ET3400A | ET3400B |
| Appearance | Liquid | Liquid |
| Color | Colorless | Orange |
| Viscosity @ 25°C, cps | 800~1,300
S21 30rpm |
900~1,400
S14 30rpm |
TYPICAL CURING PROPERTIES
| Properties | ET3400 |
| Mix Rate (A : B) By Weight | 1 : 1 |
| Pot Life, 25oC, min | 1 |
| Surface Dry Time, 25°C, h | 2.5 |
| Through Cure Time, 25°C, day | 3~4 |
| Through Cure Time, 80°C, min | 40 |
TYPICAL CURED PROPERTIES
| Properties | ET3400 |
| Glass Transition Temp., (MDSC), °C | < -60 |
| CTE *2 (>Tg), µm/m/°C | 583 |
| Durometer Hardness, Shore 00 | 43 |
| Degradation Temp.,
(TGA 10o°C/min) °C |
328 |
Technical Documents
ET3400 Technical Data Sheet
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