ET3221-High Glossiness Two Component Epoxy for Potting
ET3221 is a high-performance, two-component black epoxy resin specifically designed for the potting and encapsulation of electronic devices. This product stands out for its outstanding toughness, excellent fluidity, and ability to quickly defoam after mixing, ensuring a bubble-free finish. Engineered for reliability in extreme environments, ET3221 offers low thermal stress and superior thermal shock resistance, protecting sensitive components from mechanical and thermal failure. With its high glossiness and minimal shrinkage, it provides both functional protection and a professional aesthetic finish
Features and benefits
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Extreme Temperature Resistance: Operates reliably across a wide temperature range from -40°C to 180°C.
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Safety & Compliance: Fully complies with UL 94V-0 flame retardant standards and RoHS 2011/65/EU regulations.
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Superior Processability: Features excellent fluidity and quick defoaming properties for easy dispensing and high-quality results.
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High Reliability: Exhibits excellent toughness and low shrinkage (3.8%) to minimize stress on delicate electronic circuits.
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Electrical Protection: High insulating strength of 20 kV/mm for maximum electronic component safety.
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Aesthetic Finish: Delivers a high-gloss, sleek black surface for finished electronic modules
Specifications
TYPICAL UNCURED PROPERTIES:
| Properties | ET3221-A | ET3221-B |
| Appearance | Liquid | Liquid |
| Color | Black | Light Yellow |
| Viscosity, 250C,cps | 180000- 220000 S14 2rpm |
≤200 S21 100rpm |
| Mixing viscosity 250C,cps |
3000-5000 | |
| Specific gravity | 1.94 | 0.95 |
| Liquid mixing (A+B) specific gravity |
1.77 |
TYPICAL CURING PROPERTIES:
| Properties | Range |
| Mix ratio ( A:B) by weight | 10:1 |
| Pot life, 250C, hr | 2 |
| Tack free time , 250C, hr | 24 |
| Through cured time, 250C, day | 5-7 |
| Through cured time, 700C, hr | 3 |
TYPICAL CURED PROPERTIES
| Properties | Range |
| Glass transition temp, (MSDS) 0C | 72 |
| CTE*2 (< Tg), μm/m/0C | 41 |
| CTE*2 (> Tg), μm/m/0C | 124 |
| Durometer hardness, shore D | 87 |
| Insulating strength, kv/mm | 20 |
| Thermal conductivity, W/mK | 1 |
| Degradation temp ( TGA 100C/min) 0C | 300 |
| Specific gravity ( Solid phrase) | 1.84 |
| Volume shrinkage, % | 3.8 |
Technical Documents
Technical Data Sheet
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