ET3220 Epoxy Resin for LED Potting application
ET3220 is a versatile epoxy adhesive composed of two components that can be easily cured at room temperature once combined. It boasts a low mixing viscosity, making the potting process uncomplicated. Upon curing, it yields a smooth surface and is ideal for potting various substrates. This adhesive offers excellent mechanical strength, superior electrical insulation, and resistance to high and low temperatures. It meets both RoHS and REACH standards, making it suitable for potting GOB LED displays.
Features and benefits
- Potting of various substrates
- GOB LED display potting
- Can be cured at room temperature with good toughness
- Good mechanical strength and impact resistance
- Excellent electrical properties, uniform light transmittance, and no discoloration
- Resistant to scratches and bumps, not easily damaged
Specifications
TYPICAL UNCURED PROPERTIES
Properties | ET3220A | ET3220B |
Appearance | Liquid | Liquid |
Color | Colorless | Light yellow |
Viscosity
25°C, S14 100rpm, cps |
1500±500 | 250±100 |
Specific Gravity | 1.07±0.1 | 1.06±0.1 |
TYPICAL CURING PROPERTIES
Properties | ET3220 |
Mix Rate (A:B) By Weight | 2:1 |
Mixed viscosity, 25°C, mPa·s | 500±200 |
Pot Life, 25°C, min | >40 |
Tack-free Time, 25°C, hr | 24 |
Through Cure Time, 65°C, min | 60 |
Through Cure Time, 25 °C, day | 5 ~ 7 |
TYPICAL CURED PROPERTIES
Properties | ET3220 |
Coefficient of thermal expansion, ASTM D696 | α2:46.4 ppm/°C |
Water absorption @100°C/1h | 0.33 % |
Durometer Hardness, Shore D | 50±5 |
Technical Documents
ET3220 Technical Data SheetHow can we support you?
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