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ET3220 Epoxy Resin for LED Potting application

ET3220 is a versatile epoxy adhesive composed of two components that can be easily cured at room temperature once combined. It boasts a low mixing viscosity, making the potting process uncomplicated. Upon curing, it yields a smooth surface and is ideal for potting various substrates. This adhesive offers excellent mechanical strength, superior electrical insulation, and resistance to high and low temperatures. It meets both RoHS and REACH standards, making it suitable for potting GOB LED displays.

Features and benefits

  • Potting of various substrates
  • GOB LED display potting
  • Can be cured at room temperature with good toughness
  • Good mechanical strength and impact resistance
  • Excellent electrical properties, uniform light transmittance, and no discoloration
  • Resistant to scratches and bumps, not easily damaged

Specifications

TYPICAL UNCURED PROPERTIES

Properties ET3220A ET3220B
Appearance Liquid Liquid
Color Colorless  Light yellow
Viscosity

25°C, S14 100rpm, cps

1500±500 250±100
Specific Gravity 1.07±0.1 1.06±0.1

TYPICAL CURING PROPERTIES

Properties ET3220
Mix Rate (A:B) By Weight 2:1
Mixed viscosity, 25°C, mPa·s 500±200
Pot Life, 25°C, min >40
Tack-free Time, 25°C, hr 24
Through Cure Time, 65°C, min 60
Through Cure Time, 25 °C, day 5 ~ 7

TYPICAL CURED PROPERTIES

Properties ET3220
Coefficient of thermal expansion, ASTM D696 α2:46.4 ppm/°C
Water absorption @100°C/1h 0.33 %
Durometer Hardness, Shore D 50±5

Technical Documents

ET3220 Technical Data Sheet

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