ET3214 Off-white Two-part Epoxy for Electronics Potting
ET3214 is flexible two-component epoxy. Cured product exhibits excellent greasy resistance and chemical resistance. It is suited for electronic components potting. This product exhibits outstanding fatigue resistance and crack resistance for many vibrational applications requirements. This product exhibits better yellowing resistance than any other general epoxy. The special characteristics of this product surpass other conventional flexible epoxy.
Features and benefits
- This product has no volatile materials and will not release any toxic volatilizations.
- This product is solvent-free two-component epoxy
- This product exhibits low viscosity, excellent operability and fluidity.
- The hardening surface of this product will not exhibit a surface oiliness and poor gloss.
- This product exhibits excellent transparency.
- Cured product exhibits perfect surface gloss.
- Cured product exhibits excellent toughness and low thermal stress.
- Comply to the 2011/65/EU RoHS regulations
Specifications
TYPICAL UNCURED PROPERTIES
| Properties | ET3214-A | ET3214-B |
| Appearance | Liquid | Liquid |
| Color | Milky | Colorless |
| Viscosity
*25°C, cps |
3,000 ~ 5,000
S14, 100 rpm |
≦150
S14, 100 rpm |
| Specific Gravity | 1.16 | 0.96 |
TYPICAL CURING PROPERTIES
| Properties | ET3214 |
| Mix Ratio (A:B) by Weight | 3:1 |
| Pot Life, 25°C, hr | 8 |
| Surface Dry Time, @25°C, hr | 24 |
| Through Cured Time, @25°C, day | 5-7 |
| Through Cured Time, 80°C, hr | 1 |
TYPICAL CURED PROPERTIES (*1)
| Properties | ET3214 |
| Glass Transition Temp., (MDSC), °C | 18 |
| CTE (*2) (<Tg), μm/m/°C | 105 |
| CTE (*2) (<Tg), μm/m/°C | 245 |
| Durometer Hardness, Shore A | 58 |
| Water Absorption Ratio (25°C/24hrs), % | 1.8 |
| Water Absorption Ratio (80°C/24hrs), % | 1.9 |
| Water Absorption Ratio (97°C/1.5hrs), % | 2.4 |
| Specific Gravity | 1.1 |
| Specific Heat 0°C, J/g°C | 4.9 |
| Specific Heat 25°C, J/g°C | 5.3 |
| Specific Heat 50°C, J/g°C | 5.4 |
| Specific Heat 75°C, J/g°C | 5.5 |
| Specific Heat 100°C, J/g°C | 5.6 |
| Degradation Temp. (TGA 10°C/min), °C | 277 |
| Weight Loss Ratio @100°C, % | 0.5 |
| Weight Loss Ratio @150°C, % | 1.35 |
| Weight Loss Ratio @200°C, % | 2.13 |
| Weight Loss Ratio @250°C, % | 3.42 |
| Weight Loss Ratio @300°C, % | 8.14 |
| Volume Resistivity, ohm-cm | 5*1015 |
| Surface Resistivity, ohm | 5*1014 |
| Dielectric Constant. 100Hz | 4.1 |
Technical Documents
ET3214 Technical Data Sheet
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