ET3213 Two-part Epoxy for Optical and Electronic Devices
ET3213 is a two-part epoxy that has good thixotropic properties and it is suitable for potting applications in optical, semiconductor, electronics, and medical industries. This product is easy to operate and exhibits perfect bonding for different substrates.
Features and benefits
- High viscosity, excellent thixotropic index. This product can also be controlled flow and have sag resistance.
- Long-term working time after mixing.
- Excellent chemical resistance.
- An amber color changes upon cure for easy visual inspection.
- Low outgassing and high-temperature resistance.
- Can be applied by screen printing.
Specifications
TYPICAL UNCURED PROPERTIES
Properties | ET3213-A | ET3213-B |
Appearance | Liquid | Liquid |
Color | Gray | Yellow |
Viscosity @ 25°C, cps | 35,000~53,000 @S14 20rpm | 800~1,100 @S14 100rpm |
Thixotropic Index | 4.0~6.0 | 1.0 |
Specific Gravity | 1.16 | 1.03 |
Partical Size, μm | ≤ 20 | – |
TYPICAL CURING PROPERTIES
Properties | ET3213 |
Mix Ratio (A:B) by Weight | 10 : 1 |
Pot Life @ 25°C, hrs | 3 |
Through Cured Time @ 80°C, min | 30 |
Through Cured Time @ 100°C, min | 10 |
Through Cured Time @ 120°C, min | 5 |
Through Cured Time @ 150°C, min | 2 |
TYPICAL CURED PROPERTIES*1
Properties | ET3213 |
Glass Transition Temp. (TMA), °C | 103 |
CTE*2 (< Tg), μm/m/°C | 66 |
CTE*2 (> Tg), μm/m/°C | 200 |
Durometer Hardness, Shore A | 87 |
Water Absorption Ratio (25°C /24hr), % | 0.71 |
Water Absorption Ratio (80°C /24hr), % | 7.02 |
Water Absorption Ratio (97°C /1.5hr), % | 2.66 |
Shear Strength Al vs. Al, kgf/cm2 | 230 |
Degradation Temp., (TGA 10°C /min), °C | 364 |
Weight Loss Ratio@200°C, % | 0.0 |
Weight Loss Ratio@250°C, % | 0.5 |
Weight Loss Ratio@300°C, % | 1.9 |
Weight Loss Ratio@350°C, % | 4.2 |
Technical Documents
ET3213 Technical Data SheetHow can we support you?
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