ES3500 One component Epoxy for BGA, CSP Underfill
ES3500 is a one component epoxy and can rework adhesive for electronic devices bonding. This product is easy to operate and suited for various applications of electronic components, such as potting, casting and sealing. This resin can be fast cured at high temperature, is able to reduce the working time and increase the efficiency at the same time. This product develops tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this resin is high levels, and this resin can pass many environmental test experiments. When underfilling CSP and BGA chips, it can buffer the expansion and contraction stress of the solder ball contacts and can buffer the shear force conducted by the reaction force during the drop test.
Features and benefits
- Solvent-free, no volatile materials and will not release any toxic volatilizations
- Has low viscosity and excellent fluidity.
- The hardening surface will not exhibit a surface oiliness and poor gloss.
- The reactivity of this product is good at the temperature higher than 1500C.
- This resin excels where high rebound, fatigue and crack resistance is critical.
- Comply to the 2011/65/EU RoHS regulations
- Comply to Chlorine < 900ppm, Bromine < 900ppm, Chlorine + Bromine < 1500 ppm
Specifications
TYPICAL UNCURED PROPERTIES
| Properties | ES3500 |
| Appearance | Liquid |
| Color | Black |
| Viscosity *25°C, cps | 2,500 ~ 4,000
S14, 100 rpm |
| Specific Gravity (20/200C) | 1.18 |
TYPICAL CURING PROPERTIES
| Properties | ES3500 |
| Pot Life, 25°C, days | 2 |
| Through Cured Time 800C, min | 30 |
| Cured Time 100°C, min | 15 |
| Cured Time 1200C, min | 10 |
| Cured Time 150°C, min | 5 |
TYPICAL CURED PROPERTIES
| Properties | ES3500 |
| Glass Transition Temp., (TMA), °C | 50 |
| CTE (*6) (<Tg), μm/m/°C | 30 |
| CTE (*6) (>Tg), μm/m/°C | 178 |
| Specific Heat 00C, J/gºC | 1.01 |
| Specific Heat 500C, J/gºC | 1.40 |
| Specific Heat 1000C, J/gºC | 1.62 |
| Durometer Hardness, Shore D | 76 |
| Water Absorption Ratio (25°C/24hr), % | 0.95 |
| Water Absorption Ratio (80°C/24hr), % | 2.40 |
| Water Absorption Ratio (97°C/24hr), % | 1.89 |
| Flexural modulus, 25ºC, GPa (DMA) | 0.4 |
| Flexural modulus, 50ºC, GPa (DMA) | 0.1 |
| Flexural modulus, 100ºC, GPa (DMA) | 0.01 |
| Young’s Modulus, GPa | 0.4 |
| Elongation, % | 20 |
| Elongation breaking strength, Kgf *5 | 231 |
Technical Documents
ES3500 Technical Data Sheet
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