ES3500 One component Epoxy for BGA, CSP Underfill

ES3500 is a one component epoxy and can rework adhesive for electronic devices bonding. This product is easy to operate and suited for various applications of electronic components, such as potting, casting and sealing. This resin can be fast cured at high temperature, is able to reduce the working time and increase the efficiency at the same time. This product develops tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this resin is high levels, and this resin can pass many environmental test experiments. When underfilling CSP and BGA chips, it can buffer the expansion and contraction stress of the solder ball contacts and can buffer the shear force conducted by the reaction force during the drop test.

Features and benefits

  • Solvent-free, no volatile materials and will not release any toxic volatilizations
  • Has low viscosity and excellent fluidity.
  • The hardening surface will not exhibit a surface oiliness and poor gloss.
  • The reactivity of this product is good at the temperature higher than 1500C.
  • This resin excels where high rebound, fatigue and crack resistance is critical.
  • Comply to the 2011/65/EU RoHS regulations
  • Comply to Chlorine < 900ppm, Bromine < 900ppm, Chlorine + Bromine < 1500 ppm



Properties ES3500
Appearance Liquid
Color Black
Viscosity *25°C, cps 2,500 ~ 4,000

S14, 100 rpm

Specific Gravity (20/200C) 1.18


Properties ES3500
Pot Life, 25°C, days 2
Through Cured Time 800C, min 30
Cured Time 100°C, min 15
Cured Time 1200C, min 10
Cured Time 150°C, min 5


Properties ES3500
Glass Transition Temp., (TMA), °C 50
CTE (*6) (<Tg), μm/m/°C 30
CTE (*6) (>Tg), μm/m/°C 178
Specific Heat 00C, J/gºC 1.01
Specific Heat 500C, J/gºC 1.40
Specific Heat 1000C, J/gºC 1.62
Durometer Hardness, Shore D 76
Water Absorption Ratio (25°C/24hr), % 0.95
Water Absorption Ratio (80°C/24hr), % 2.40
Water Absorption Ratio (97°C/24hr), % 1.89
Flexural modulus, 25ºC, GPa (DMA) 0.4
Flexural modulus, 50ºC, GPa (DMA) 0.1
Flexural modulus, 100ºC, GPa (DMA) 0.01
Young’s Modulus, GPa 0.4
Elongation, % 20
Elongation breaking strength, Kgf *5 231

Technical Documents

ES3500 Technical Data Sheet

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