ES1503 Red Glue – Epoxy Adhesive for Chip bonder
ES1503 is a heat-cured adhesive that falls under the category of one-component epoxy adhesives. It has been specifically formulated for stencil printing and boasts high bonding strength, resilience to high humidity, outstanding electrical performance, and reliable storage stability.
Features and benefits
- Solvent-free, non-volatile, which offers excellent retention of electrical insulation properties under high humidity conditions.
- Medium viscosity and excellent thixotropy, which can be controlled flow and have sag resistance.
- Fast curing helps to shorten the working time
- Low stress, shrinkage, and water absorption
Specifications
TYPICAL UNCURED PROPERTIES
| Properties | ES1503 |
| Appearance | Paste |
| Color | Red |
| Viscosity @25°C, Pas
Brookfield RV, Spindle 7 |
200,000 ~ 400,000 |
| Thixotropic Index | 7 |
| Density, g/cm3 | 1.35 |
TYPICAL CURING PROPERTIES
| Properties | ES1503 |
| Pot Life, 25°C, days | 14 |
| Through Cured Time 120°C by hot place, sec | 90~120s |
| Through Cured Time 150°C by hot place, sec | 60~90s |
TYPICAL CURED PROPERTIES
| Properties | ES1503 |
| Hardness (Shore D) | 88 |
| Shear Strength, MPa | 18.5 |
| Tg (0C), DSC | 105 |
| Dielectric strength, kV/mm | 26.8 |
| Surface resistance (Ohm) | 3.5*1016 |
Technical Documents
ES1503 Technical Data Sheet
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