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AT5130-Two-part Structural Acrylic Adhesive for Low-Surface-Energy Bonding

AT5130 is a premier, solvent-free two-component acrylic-based structural adhesive specifically developed for high-performance bonding of low-surface-energy (LSE) thermoplastics. Engineered to eliminate the need for primers or complex surface pre-treatments, it provides exceptional adhesion to challenging substrates such as polypropylene (PP), polyethylene (PE), polyamide (PA), and TPO

Features and benefits

  • Primerless LSE Bonding: Superior adhesion to PP, PE, TPO, and PA without the cost and time of surface pre-treatment.

  • Exceptional Durability: Provides excellent thermal stability, water resistance, and chemical resistance (including salt-water, brine, and diesel).
  • Mechanical Fastener Replacement: Replaces screws and rivets, reducing weight and preventing stress concentration in structural assemblies

  • Thixotropic Consistency: Non-sagging paste formula allows for precise application on vertical or overhead surfaces.

  • Multi-Substrate Versatility: Effectively bonds plastics to metals (Steel, Aluminum, Copper) and composite materials like FRP.

  • Environmental & Safety Compliance: Solvent-free, low-odor formulation that fully complies with RoHS 2011/65/EU standards.

Specifications

TYPICAL UNCURED PROPERTIES

Properties AT5130A AT5130B
Appearance Milk to creamy liquid Milk to creamy liquid
Viscosity *25°C, cps 45,000~60,000 25,000-40,000
Specific gravity 1.06-1.21 1.02-1.12

 

TYPICAL CURED PROPERTIES

Glass Transition Temp. Tg (MDSC, °C) -10
CTE below Tg (µm/m/°C) 123
CTE above Tg (µm/m/°C) 176
Specific Gravity 1.15
Durometer Hardness, Shore D 60
Peel Strength (kgf) 14
Weight Loss @ 100°C (%) < 0.5
Weight Loss @ 200°C (%) 1.3
Weight Loss @ 300°C (%) 8.9
Degradation Temp. 5 wt% (TGA 10°C/min, °C) 228
Thermal Conductivity (W/mK) 0.25
Thermal Resistance (m²K/W) 0.006
Volume Resistivity (ohm-cm) 4.3 × 1013
Surface Resistivity (ohm) 4.2 × 1012
Dielectric Constant @ 100 Hz 4.6 / 0.03
Dielectric Constant @ 10 kHz 4.4 / 0.02
Dielectric Constant @ 1 MHz 4.2 / 0.02
Dielectric Strength (kV/mm) 16
Recommended Service Temp. Range (°C) -40 to 100

 

Technical Documents

Technical Data Sheet

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