Thermal Interface Material
formulated a comprehensive range of thermal management materials
Effective control of heat is an increasing concern among today’s electronic device manufacturers
To address the thermal demands of today’s electronic devices, GLUDITEC has developed a complete portfolio of high-performance, user-friendly products. Effective control of heat is an increasing concern among today’s electronic device manufacturers and, as products become smaller, the need to dissipate damaging heat effectively will be greater than ever.
Of course, each application is unique and its requirements specific, which is why GLUDITEC has formulated a comprehensive range of thermal management materials to suit a variety of current and future heat control needs. Our thermal management materials include:
GLUDITEC liquid adhesives — sometimes referred to as thermally conductive 'glue' — provide robust mechanical attachment, allowing for the elimination of fasteners such as screws and clips.
Phase Change material products replace grease as the interface between power devices and heat sinks. GLUDITEC dispensable and printable phase change thermal compounds create a significantly thinner bondline and lower thermal resistance as compared to other formats
Thermal gap filler materials can conform to highly intricate topographies and multi-level surfaces, delivering better wet-out for optimized thermal resistance that is generally lower than more solid pad-based mediums.
ideal option for easily compensating for voids within assemblies. This makes them a perfect solution for use in devices that have issues with flatness or coplanarity.
soft, conformable thermal pads that provide effective thermal interfaces between heat sinks and electronic devices, accommodating for uneven surfaces, air gaps, and rough surface textures.
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