Thermal Gap Filler
Low stress, high volume capable, liquid gap filling TIMs
The materials provide excellent thermal and mechanical performance, while inducing virtually zero stress on components during assembly
Liquid Gap Fillers are expertly engineered, thermally-conductive gap filling liquid materials designed to enable dispensing application for high volume manufacturing operations. The materials provide excellent thermal and mechanical performance, while inducing virtually zero stress on components during assembly. Because they are liquid mediums, thermal gap filler materials can conform to highly intricate topographies and multi-level surfaces, delivering better wet-out for optimized thermal resistance that is generally lower than more solid pad-based mediums. Application volume and pattern is completely adaptable.
Recommended 2K Dispensing System.
Understanding the intricacies of balancing filler content, thermal conductivity requirements and equipment integrity, our gap fillers are optimized liquid gap filler materials that can be deposited in extremely high volume for industries like automotive where large systems require maximum heat dissipation.
Liquid gap fillers are supplied as a two-component, room or elevated temperature curing systems, resulting in a soft, thermally conductive, form-in-place elastomer ideal for coupling heat producing devices with an adjacent metal case or heat sink. Thermally conductive liquid gap fillers are primarily for applications where stronger structural bonds are not required. If structural bonding is needed, GLUDITEC thermal adhesives area an ideal solution.
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