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Low Pressure Molding Machine

Low Pressure Molding Machine is one of two factors making significant effect on performance of thermoplastic molding process. GLUMO is specifically designed to be compatible with materials like copolyesters and polyamides. With very low injection pressure (20 ~ 500psi), our machine is confident to mold, seal, encapsulate to protect the most delicate electronic components against moisture, dust, high temperature, water and solvents, chemical, vibration and other agents in working environment.

In addition, GLUMO series can be customizable. Each application and manufacturing process will have different requirements about dimensions of working area, sharp design, configuration as well as performance index (cycle time, maximum pressure, temperature). After inspecting carefully customer demand, we could tailor-make their own unique version to provide the best performance of LPM process.

Low-Pressure Molding is currently a new method to protect electronics devices fast and perfectly. The simplicity of this method is its advantage: low pressure, short cycle time, and not damaging. For these reasons, LPM is increasingly being chosen as an alternative to the potting and encapsulating method.

To make benefits for production in large and high-productivity factories, a low-pressure molding station series has been designed. These modular systems can be easily independently operated or integrated inline for mass production according to user’s demand.

Every component: material preparation devices, tool holders, valves, or cooling and heating units perform perfectly so as to form a continuous and precise molding process.

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Low-Pressure Molding is currently a new method to protect electronics devices fast and perfectly. The simplicity of this method is its advantage: low pressure, short cycle time, and not damaging. For these reasons, LPM is increasingly being chosen as an alternative to potting and encapsulating method.

Desktop Molding Machine is a perfect option for small to medium production, which is the balance of economical and effective factors. This product line with larger material storage, stable air pressure injection make it ideal for many applications in modern connectors, electronic components, printed circuit boards, and lighting applications, etc.

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Low-Pressure Molding is currently a new method to protect electronics devices fast and perfectly. The simplicity of this method is its advantage: low pressure, short cycle time, and not damaging. For these reasons, LPM is increasingly being chosen as an alternative to the potting and encapsulating method.

To provide customers with initial testing equipment for mass production LPM, Low-Pressure Molding Gun Series has been built. These guns are believed to provide the most flexible and exceptional experience of LPM.

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