Low-Pressure Molding is currently a new method to protect electronics devices fast and perfectly. The simplicity of this method is its advantage: low pressure, short cycle time, and not damaging. For these reasons, LPM is increasingly being chosen as an alternative to the potting and encapsulating method.
To make benefits for production in large and high-productivity factories, a low-pressure molding station series has been designed. These modular systems can be easily independently operated or integrated inline for mass production according to user’s demand.
Every component: material preparation devices, tool holders, valves, or cooling and heating units perform perfectly so as to form a continuous and precise molding process.