Low-Pressure Molding is currently a new method to protect electronics devices fast and perfectly. The simplicity of this method is its advantage: low pressure, short cycle time, and not damaging. For these reasons, LPM is increasingly being chosen as an alternative to the potting and encapsulating method.

To provide customers with initial testing equipment for mass production LPM, Low-Pressure Molding Gun Series has been built. These guns are believed to provide the most flexible and exceptional experience of LPM.