Chipbonder

Chipbonder, a surface mount adhesive, is utilized to secure components in position during component placement and soldering. The manufacturer’s continuous endeavor to decrease production times necessitates quicker methods for adhesive deposition, faster chip shooters, and shorter adhesive cure and solder cycles.

GLUDITEC’s Red Glue Series is designed to cater to various SMA application technologies, including syringe dispensing, printing, and pin transfer, to meet specific requirements. By utilizing GLUDITEC Chipbonder SMA, exceptional performance is guaranteed across all application methods.

GLUDITEC Red Glue BENEFITS

• Dot deposition without stringing
• Consistent dot shape
• High wet strength
• Flexible curing properties
• Prevent chip loss
• Stably electrical and mechanical properties

APPLICATION

• Syringe dispensing.
• Varidot and stencil printing.
• Pin transfer