Thermal Pad Pick & Place
Drastically reduce cycle time and achieve flawless thermal pad placement — at scale
Placing thermal interface materials (TIMs) by hand is one of the most persistent bottlenecks in electronics assembly. Silicone thermal pads are soft, tacky, and easily contaminated — making manual pick-and-place slow, inconsistent, and impossible to sustain at high volume. For PCBs with 10, 20, or even 50+ thermal pad positions, manual placement becomes the single largest contributor to line cycle time.
This challenge is accelerating across industries where thermal management is mission-critical: EV battery management systems and inverters, power electronics modules (IGBT, SiC, GaN), 5G base station and telecom infrastructure, AI server boards, and data center hardware. In these applications, every thermal gap pad must be placed precisely, cleanly, and repeatedly — at production speeds that manual operators simply cannot match.
GLUDITEC’s automated thermal pad pick and place machines solve this with dual-CCD vision alignment, Z-axis pressure control, and continuous coil-fed operation — delivering 3-second placement cycles, ±0.3mm accuracy, and zero skin-oil contamination. Whether you’re working with ultra-soft gap fillers (Shore 00 15–40) or rigid thermal interface pads, our systems adapt to your material and throughput requirements.
Each system is engineered for a specific production scenario. Tell us your PCB dimensions, pad count, material type, and target output — we’ll recommend the right configuration.
Need help choosing the right thermal pad placement system?
Tell us your PCB size, number of thermal pad positions, TIM material type, and target throughput — our process engineers will recommend the optimal automated solution.
How can we support you?
If you need any assistance, do not hesitate to contact us