The introduction of adhesive technology has expanded its applications in printed circuit boards

A Printed Circuit Board (PCB) serves as the foundational platform for mounting electronic components. Its key offerings include copper foil substrates, rigid and flexible printed circuit boards, along with IC carrier boards, making it a crucial component in all electronic devices. The classification of the base material is typically based on its insulation properties, composition, or its ability to resist flames. Common materials used include bakelite, glass fiber, and various types of plastics. To create a PCB substrate, manufacturers often employ an insulating material known as prepreg, which is a combination of glass fiber non-woven fabrics and epoxy resins. This is then laminated with copper foil to produce a copper foil substrate ready for assembly.

PCBA multiple layer construction

Source: Milan Yogendrappa. How to build a Multiple PCB Stack-up

At GLUDITEC, we offer wide range of technology of specialty materials & equipment to cover the PCB assembly applications.

These applications are updated on a daily basic below. Besides, maybe you can familiar with following applications already:

A conformal coating is a thin polymeric film applied to a printed circuit board (PCB) to protect the board and its components from the operating environment and corrosion.

See details

Chip underfill adhesive process, epoxy resin is typically applied along the L-shaped path on two adjacent sides of the wafer; Low Viscosity and High Fluidity: Enhance application efficiency with chip underfill adhesive featuring low viscosity and high fluidity, enabling easy operation during dispensing and filling processes.

See details

How can we support you?

If you need any assistance, do not hesitate to contact us